MCP 产品

MCP(多芯片封装存储器),广泛应用于通信模块、IoT等领域。

Part No. Den. Org. Voltage Package Dim.(mm) Status Speed Temperature Model

Notes

  • Temperature Specification:

    MCP: E = Extended grade(-25 °C to +85 °C); I = Industrial grade(-40 °C to +85 °C)