DDR3

内嵌自检测修复(ECC)DRAM芯片系列产品是西安紫光国芯推出的商用内嵌ECC技术DRAM芯片产品,具有高可靠、大容量、高位宽、高宽温、多接口等特点,与传统JEDEC标准DRAM芯片“即插即用”式兼容 。 针对质量有更高要求的用户,西安紫光国芯提供超稳健性XR ECC DRAM芯片系列产品。

Part No. Den. Org. Voltage Package Dim.(mm) Status Speed Temperature Model
SCE15H1G800AF

1Gb

128Mbx8

1.5V

TFBGA78

8x10.5

MP

1600/1333/1066

I A3 A2 A1

IBIS

SCE15H1G160AF

1Gb

64Mbx16

1.5V

TFBGA96

9x13

MP

1600/1333/1066

I A3 A2 A1

IBIS

Notes

  • Temperature Specification

    C = Commercial Grade (0℃~95℃)

    I = Industrial Grade (-40℃~95℃), LPDDR4(x) -40℃~85℃

    A1 = Auto Grade 1 -40℃~125℃ (AEC-Q100,TS16949 Complied)

    A2 = Auto Grade 2 -40℃~105℃ (AEC-Q100,TS16949 Complied)

    A3 = Auto Grade 3 -40℃~95℃ (AEC-Q100,TS16949 Complied), LPDDR4(x) -40℃~85℃

  • MP

    Mass Production