DDR2

内嵌自检测修复(ECC)DRAM芯片系列产品是西安紫光国芯推出的商用内嵌ECC技术DRAM芯片产品,具有高可靠、大容量、高位宽、高宽温、多接口等特点,与传统JEDEC标准DRAM芯片“即插即用”式兼容。针对质量有更高要求的用户,西安紫光国芯提供超稳健性XR ECC DRAM芯片系列产品。

Part No. Den. Org. Voltage Package Dim.(mm) Status Speed Temperature Model
SCX18T512800AF

512Mb

64Mbx8

1.8V

TFBGA60

8x10

MP

1066/800/667

C I A3

IBIS

SCX18T512160AF

512Mb

32Mbx16

1.8V

TFBGA84

8x12.5

MP

1066/800/667

C I A3

IBIS

SCE18T1G800AF

1Gb

128Mbx8

1.8V

TFBGA60

8x10

MP

1066/800/667

C I A3

IBIS

SCE18T1G160AF

1Gb

64Mbx16

1.8V

TFBGA84

8x12.5

MP

1066/800/667

C I A3

IBIS

Notes

  • Temperature Specification:

    C = Commercial Temperature chip (DDR2, DDR3, DDR4: 0°C ~ +95°C; LPDDR2: 0°C ~ +85°C;SDR, DDR: 0°C ~ +70°C)

    I = Industrial Temperature chip (DDR2, DDR3: -40°C ~ +95°C; SDR, DDR, LPDDR2, LPDDR4: -40°C ~ +85°C)

    A1 = Automotive grade 1(-40°C ~ +125°C)

    A2 = Automotive grade 2(-40°C ~ +105°C)

    A25 = Automotive grade 2(-40°C ~ +115°C)

    A3 = Automotive grade 3(-40°C ~ +95°C);LPDDR4(-40°C ~ +85°C)