SPI NAND

采用业内先进的制程,提供多种封装及产品等级,广泛应用于汽车、电力、视频监控、基站、光猫、路由器、机顶盒等行业。

Part No. Interface Bus Width Den. Voltage Package Dim.(mm) Status Temperature Model
SCF0BW1I2A

SPI

x1/x2/x4

512Mbit

3.3V

WSON8

8x6

CS

I

SCF0AW1I2A

SPI

x1/x2/x4

512Mbit

1.8V

WSON8

8x6

CS

I

SCF4BW1I3A

SPI

x1/x2/x4

4Gbit

3.3V

WSON8

8x6

CS

I

SCF4AW1I3A

SPI

x1/x2/x4

4Gbit

1.8V

WSON8

8x6

CS

I

SCF2BW1I3A

SPI

x1/x2/x4

2Gbit

3.3V

WSON8

8x6

CS

I

SCF2AW1I3A

SPI

x1/x2/x4

2Gbit

1.8V

WSON8

8x6

CS

I

SCF1BW1C2A

SPI

x1/x2/x4

1Gbit

3.3V

WSON8

8x6

CS

C

SCF1BW1I3A

SPI

x1/x2/x4

1Gbit

3.3V

WSON8

8x6

CS

I

SCF1BW2C2A

SPI

x1/x2/x4

1Gbit

3.3V

WSON8

6x5

CS

C

SCF1BW2I3A

SPI

x1/x2/x4

1Gbit

3.3V

WSON8

6x5

CS

I

SCF1AW1C2A

SPI

x1/x2/x4

1Gbit

1.8V

WSON8

8x6

CS

C

SCF1AW1I3A

SPI

x1/x2/x4

1Gbit

1.8V

WSON8

8x6

CS

I

SCF1AW2C2A

SPI

x1/x2/x4

1Gbit

1.8V

WSON8

6x5

CS

C

SCF1AW2I3A

SPI

x1/x2/x4

1Gbit

1.8V

WSON8

6x5

CS

I

Notes

  • Temperature Specification:

    SLC: C =Commercial Temperature(-25 °C to +70 °C); I = Industrial Commercial Temperature(-40 °C to +85 °C)